MC100EP210SMNG
vs
ICS85356AM
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFN32, 5x5, 0.5P, 3.1x3.1EP
|
SOIC
|
Package Description |
QFN-32
|
SOP,
|
Pin Count |
32
|
20
|
Manufacturer Package Code |
488AM
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Family |
100E
|
|
Input Conditioning |
DIFFERENTIAL
|
|
JESD-30 Code |
S-XQCC-N32
|
R-PDSO-G20
|
JESD-609 Code |
e3
|
e0
|
Length |
5 mm
|
12.8 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
2
|
Number of Inverted Outputs |
|
|
Number of Terminals |
32
|
20
|
Number of True Outputs |
5
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOP
|
Package Equivalence Code |
LCC32,.2SQ,20
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
0.675 ns
|
|
Propagation Delay (tpd) |
0.65 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.025 ns
|
|
Seated Height-Max |
1 mm
|
2.65 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5 mm
|
7.5 mm
|
Base Number Matches |
1
|
6
|
|
|
|
Compare MC100EP210SMNG with alternatives
Compare ICS85356AM with alternatives