MC100EP29MNG
vs
MC100EP29DT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN20, 4x4, 0.5P
|
TSSOP
|
| Package Description |
QFN-20
|
|
| Pin Count |
20
|
20
|
| Manufacturer Package Code |
48.5
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
|
| Family |
100E
|
|
| JESD-30 Code |
S-XQCC-N20
|
|
| JESD-609 Code |
e3
|
|
| Length |
4 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.5 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
4 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare MC100EP29MNG with alternatives
Compare MC100EP29DT with alternatives