MC100LVELT22DR2
vs
ICS853L022AG
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
PLASTIC, SOIC-8
|
TSSOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
0.6 ns
|
0.75 ns
|
| Interface IC Type |
TTL/CMOS TO PECL TRANSLATOR
|
TTL/CMOS TO PECL TRANSLATOR
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
3 mm
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Voltage-Max |
3.8 V
|
5.25 V
|
| Supply Voltage-Min |
3 V
|
2.375 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
No
|
| Additional Feature |
|
ECL MODE : VEE = -2.375V TO -5.25V WITH VCC=0V
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MC100LVELT22DR2 with alternatives
Compare ICS853L022AG with alternatives