MC10EP142MNG
vs
MC100EP142FAG
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
HVQCCN,
|
LEAD FREE, LQFP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE
|
ECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V; SIPO OPERATION ALSO AVAILABLE
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
10E
|
100E
|
| JESD-30 Code |
S-PQCC-N32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
7 mm
|
| Logic IC Type |
PARALLEL IN PARALLEL OUT
|
PARALLEL IN PARALLEL OUT
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Number of Bits |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
0.8 ns
|
0.8 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
1 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
5 mm
|
7 mm
|
| Base Number Matches |
2
|
2
|
| fmax-Min |
|
3000 MHz
|
|
|
|