MC14008BDR2
vs
HCF4063BC1
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
PLASTIC, SOIC-16
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
9.9 mm
|
8.9662 mm
|
| Logic IC Type |
ADDER/SUBTRACTOR
|
MAGNITUDE COMPARATOR
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP16,.25
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Propagation Delay (tpd) |
800 ns
|
1250 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3.9 mm
|
8.9662 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
CASCADABLE
|
| Load Capacitance (CL) |
|
50 pF
|
| Output Polarity |
|
TRUE
|
|
|
|
Compare MC14008BDR2 with alternatives
Compare HCF4063BC1 with alternatives