MC14011BCP vs M38510H05051SCA feature comparison

MC14011BCP Motorola Mobility LLC

Buy Now Datasheet

M38510H05051SCA Intersil Corporation

Buy Now
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC HARRIS SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 18.86 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 5 2
Screening Level MIL-PRF-38535 Class S
Total Dose 1M Rad(Si) V

Compare MC14011BCP with alternatives

Compare M38510H05051SCA with alternatives