MC14024BFL1
vs
HEF4024BTD
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP14,.3
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Count Direction |
UP
|
UP
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e4
|
Length |
10.2 mm
|
8.65 mm
|
Load Capacitance (CL) |
50 pF
|
|
Load/Preset Input |
NO
|
YES
|
Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
Max Frequency@Nom-Sup |
1000000 Hz
|
|
Max I(ol) |
0.00088 A
|
|
Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Number of Bits |
7
|
7
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Propagation Delay (tpd) |
2000 ns
|
200 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.05 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
Width |
5.275 mm
|
3.9 mm
|
fmax-Min |
4 MHz
|
35 MHz
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC14024BFL1 with alternatives
Compare HEF4024BTD with alternatives