MC14060BDTR2G
vs
MC14060BALS
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP-16
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
948F-01
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
11 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Count Direction |
UP
|
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
3500000 Hz
|
|
| Mode of Operation |
ASYNCHRONOUS
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
14
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
740 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
NEGATIVE EDGE
|
|
| Width |
4.4 mm
|
|
| fmax-Min |
12 MHz
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
,
|
|
|
|
Compare MC14060BDTR2G with alternatives
Compare MC14060BALS with alternatives