MC2010-1181-FT101
vs
MC2010P-1181-FB101
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
RCD COMPONENTS INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Additional Feature
PRECISION
PRECISION
Construction
Chip
Chip
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.6 mm
2.6 mm
Packing Method
TR
BULK
Rated Power Dissipation (P)
0.75 W
0.75 W
Rated Temperature
70 °C
Resistance
1180 Ω
1180 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
3
3
Compare MC2010-1181-FT101 with alternatives
Compare MC2010P-1181-FB101 with alternatives