MC56F8257VLH vs MC56F8257VLH feature comparison

MC56F8257VLH Rochester Electronics LLC

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MC56F8257VLH NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BCD, LQFP-64 10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BCD, LQFP-64
Pin Count 64
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 16 16
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels YES YES
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 54 54
Number of Terminals 64 64
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 60 MHz 60 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
CPU Family 56800E
On Chip Program ROM Width 8
Package Equivalence Code QFP64,.47SQ,20
Qualification Status Not Qualified
RAM (bytes) 8192
ROM (words) 65536