MC68010R8
vs
MC68HC000L12F
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, PGA68,10X10
|
DIP, DIP64,.9
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
23
|
24
|
| Bit Size |
32
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
8 MHz
|
16.67 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
R-PDIP-T64
|
R-CDIP-T64
|
| JESD-609 Code |
e0
|
e0
|
| Length |
81.535 mm
|
81.28 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
7
|
3
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
64
|
64
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
PGA68,10X10
|
DIP64,.9
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
5.84 mm
|
4.32 mm
|
| Speed |
8 MHz
|
16.67 MHz
|
| Supply Current-Max |
25 mA
|
50 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
22.86 mm
|
22.86 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare MC68010R8 with alternatives
Compare MC68HC000L12F with alternatives