MC68010R8 vs MC68000R8 feature comparison

MC68010R8 Motorola Semiconductor Products

Buy Now Datasheet

MC68000R8 Freescale Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description PLASTIC, DIP-64 PGA, PGA68,10X10
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Address Bus Width 23
Bit Size 32 32
Boundary Scan NO
Clock Frequency-Max 8 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDIP-T64 S-XPGA-P68
JESD-609 Code e0 e0
Length 81.535 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 64 68
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP PGA
Package Equivalence Code PGA68,10X10 PGA68,10X10
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 5.84 mm
Speed 8 MHz 8 MHz
Supply Current-Max 25 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 3 3
Power Supplies 5 V

Compare MC68010R8 with alternatives