MC68020FE25
vs
MC68020FE25
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
QFP, QFP132,1.2SQ
|
QFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CQFP-G132
|
S-CQFP-G132
|
| JESD-609 Code |
e0
|
|
| Length |
22.355 mm
|
22.355 mm
|
| Low Power Mode |
NO
|
NO
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
8
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
132
|
132
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP132,1.2SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.31 mm
|
4.31 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
22.355 mm
|
22.355 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
132
|
|
|
|
Compare MC68020FE25 with alternatives
Compare MC68020FE25 with alternatives