MC68332ACEH20
vs
TS68332MA20
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
THOMSON-CSF SEMICONDUCTORS
|
Package Description |
0.950 X 0.950 INCH, 0.025 INCH PITCH, PLASTIC, ROHS COMPLIANT, QFP-132
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
13 Weeks
|
|
Date Of Intro |
1988-01-01
|
|
Samacsys Manufacturer |
NXP
|
|
Has ADC |
NO
|
NO
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
20 MHz
|
20.97 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G132
|
S-GQFP-G132
|
JESD-609 Code |
e3
|
|
Length |
24.13 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
31
|
32
|
Number of Terminals |
132
|
132
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
PWM Channels |
YES
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
BQFP
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
ROM LESS
|
|
Seated Height-Max |
4.572 mm
|
|
Speed |
20 MHz
|
20.97 MHz
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
24.13 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
4
|
Supply Voltage-Max |
|
5.25 V
|
Supply Voltage-Min |
|
4.75 V
|
|
|
|
Compare TS68332MA20 with alternatives