MC68881RC16
vs
80387DXRPQB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MAXWELL TECHNOLOGIES INC
|
| Package Description |
PGA, PGA68,10X10
|
QFF, QFL68,.95SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-XPGA-P68
|
S-XQFP-F68
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC
|
UNSPECIFIED
|
| Package Code |
PGA
|
QFF
|
| Package Equivalence Code |
PGA68,10X10
|
QFL68,.95SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
150 mA
|
390 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
PIN/PEG
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
68
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.31.00.01
|
| Boundary Scan |
|
NO
|
| Bus Compatibility |
|
80386
|
| External Data Bus Width |
|
32
|
| Length |
|
24.13 mm
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
|
3.683 mm
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Width |
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MATH PROCESSOR, COPROCESSOR
|
|
|
|
Compare 80387DXRPQB with alternatives