MC68881RC16
vs
80387DXRPQE
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
DATA DEVICE CORP
|
| Package Description |
PGA, PGA68,10X10
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-XPGA-P68
|
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
68
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC
|
|
| Package Code |
PGA
|
|
| Package Equivalence Code |
PGA68,10X10
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
150 mA
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
PIN/PEG
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
PERPENDICULAR
|
|
| Base Number Matches |
3
|
2
|
| HTS Code |
|
8542.31.00.01
|
| uPs/uCs/Peripheral ICs Type |
|
MATH PROCESSOR, COPROCESSOR
|
|
|
|
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