MC68882FN20
vs
5962-8946302YC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Package Description |
QCCJ, LDCC68,1.0SQ
|
QFP, QFP68,1.1SQ,50
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
5
|
5
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
MC68882
|
|
Clock Frequency-Max |
20 MHz
|
20 MHz
|
External Data Bus Width |
32
|
32
|
JESD-30 Code |
S-PQCC-J68
|
S-CQFP-G68
|
JESD-609 Code |
e0
|
e0
|
Length |
24.2062 mm
|
24.13 mm
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
QFP
|
Package Equivalence Code |
LDCC68,1.0SQ
|
QFP68,1.1SQ,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
3.43 mm
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.2062 mm
|
24.13 mm
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
Base Number Matches |
3
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Screening Level |
|
MIL-PRF-38535
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC68882FN20 with alternatives
Compare 5962-8946302YC with alternatives