MC68882RC25A
vs
5962-8946303YC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
PGA
|
QFP
|
| Package Description |
PGA-68
|
QFP, QFP68,1.1SQ,50
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
5
|
5
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
MC68882
|
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-CPGA-P68
|
S-CQFP-G68
|
| Length |
26.92 mm
|
24.13 mm
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
QFP
|
| Package Equivalence Code |
PGA68,10X10
|
QFP68,1.1SQ,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.59 mm
|
3.43 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
PIN/PEG
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
26.92 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Screening Level |
|
MIL-PRF-38535
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MC68882RC25A with alternatives
Compare 5962-8946303YC with alternatives