MC68EC000FN20R2
vs
TS68C000DESC02XAA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
PLASTIC, LCC-68
|
QCCN,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
10 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQCC-J68
|
S-CQCC-N68
|
| JESD-609 Code |
e0
|
|
| Length |
24.2062 mm
|
24.13 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QCCN
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
20 MHz
|
10 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
24.2062 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare MC68EC000FN20R2 with alternatives
Compare TS68C000DESC02XAA with alternatives