MC68HC000FN12 vs 68000-6/BUC feature comparison

MC68HC000FN12 Motorola Semiconductor Products

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68000-6/BUC YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC PHILIPS COMPONENTS
Package Description PLASTIC, LCC-68 ,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 24
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 12 MHz 6 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-J68 S-CQCC-N68
JESD-609 Code e0
Length 24.2062 mm
Low Power Mode NO NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 68 68
On Chip Data RAM Width
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.57 mm
Speed 12 MHz 6 MHz
Supply Current-Max 35 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Width 24.2062 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 2

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