MC68HC000P10 vs MC68HC000P10 feature comparison

MC68HC000P10 Motorola Semiconductor Products

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MC68HC000P10 Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 23
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 10 MHz 10 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDIP-T64 R-PDIP-T64
JESD-609 Code e0 e0
Length 81.535 mm 81.535 mm
Low Power Mode NO NO
Number of DMA Channels
Number of External Interrupts 7 7
Number of Serial I/Os
Number of Terminals 64 64
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 5.84 mm 5.84 mm
Speed 10 MHz 10 MHz
Supply Current-Max 30 mA 30 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 22.86 mm 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Part Package Code DIP
Pin Count 64

Compare MC68HC000P10 with alternatives

Compare MC68HC000P10 with alternatives