MC68HC000P8 vs TS68C000VC8A feature comparison

MC68HC000P8 Motorola Semiconductor Products

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TS68C000VC8A e2v technologies

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TELEDYNE E2V (UK) LTD
Package Description PLASTIC, DIP-64 CERAMIC, SDIP-64
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 23 24
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 8 MHz 8 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDIP-T64 R-CDIP-T64
JESD-609 Code e0
Length 81.535 mm 81.28 mm
Low Power Mode NO NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 64 64
On Chip Data RAM Width
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 5.84 mm 4.83 mm
Speed 8 MHz 8 MHz
Supply Current-Max 25 mA 42 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS HCMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 22.86 mm 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Part Package Code DIP
Pin Count 64
Package Equivalence Code DIP64,.9

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