MC68HC000R8 vs MC68000P8 feature comparison

MC68HC000R8 Motorola Semiconductor Products

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MC68000P8 Freescale Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description PLASTIC, DIP-64 DIP, DIP64,.9
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Address Bus Width 24
Bit Size 32 32
Boundary Scan NO
Clock Frequency-Max 8 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDIP-T64 R-PDIP-T64
JESD-609 Code e0 e0
Length 81.535 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
Number of Terminals 64 64
On Chip Data RAM Width
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code PGA68,10X10 DIP64,.9
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 5.84 mm
Speed 8 MHz 8 MHz
Supply Current-Max 25 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 3 3
Power Supplies 5 V

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