MC68HC11A1FN
vs
MC68HC11A1FNR2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
LCC
|
QFN
|
| Package Description |
QCCJ,
|
|
| Pin Count |
52
|
52
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
|
| Clock Frequency-Max |
2.1 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-J52
|
|
| JESD-609 Code |
e0
|
|
| Length |
19.1262 mm
|
|
| Number of I/O Lines |
38
|
|
| Number of Terminals |
52
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| ROM Programmability |
EEPROM
|
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
2.1 MHz
|
|
| Supply Current-Max |
27 mA
|
|
| Surface Mount |
YES
|
|
| Technology |
HCMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
19.1262 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
4
|
3
|
|
|
|
Compare MC68HC11A1FN with alternatives