MC68HC11E0CFN3R2
vs
MC68HC11E0CFN3
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
PLASTIC, LCC-52
|
QCCJ, LDCC52,.8SQ
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
| Length |
19.125 mm
|
19.1262 mm
|
| Number of I/O Lines |
38
|
38
|
| Number of Terminals |
52
|
52
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
MROM
|
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Speed |
3 MHz
|
3 MHz
|
| Supply Current-Max |
35 mA
|
35 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.125 mm
|
19.1262 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
6
|
| Rohs Code |
|
No
|
| Part Package Code |
|
LCC
|
| Pin Count |
|
52
|
| ECCN Code |
|
EAR99
|
| CPU Family |
|
6800
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
LDCC52,.8SQ
|
| Peak Reflow Temperature (Cel) |
|
220
|
| RAM (bytes) |
|
512
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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