MC68HC11E1CFNE3R vs MC68HC11E1MFNE2 feature comparison

MC68HC11E1CFNE3R Freescale Semiconductor

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MC68HC11E1MFNE2 Freescale Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Package Description LCC-52 QCCJ,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature SEATED HEIGHT CALCULATED SEATED HEIGHT CALCULATED
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
CPU Family 6800
Clock Frequency-Max 12 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J52 S-PQCC-J52
JESD-609 Code e3 e3
Length 19.125 mm 19.125 mm
Low Power Mode YES
Moisture Sensitivity Level 3 3
Number of I/O Lines 38 38
Number of Terminals 52 52
On Chip Data RAM Width 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC52,.8SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 260 260
RAM (bytes) 512 512
ROM (words) 512 0
ROM Programmability OTPROM
Seated Height-Max 5.08 mm 5.08 mm
Speed 3 MHz 2 MHz
Supply Current-Max 35 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 19.125 mm 19.125 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2

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