MC68HC11E1CFNE3R vs MC68HC11E9BCFN3 feature comparison

MC68HC11E1CFNE3R Freescale Semiconductor

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MC68HC11E9BCFN3 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Package Description LCC-52 SDIP-56
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature SEATED HEIGHT CALCULATED
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
CPU Family 6800 68HC11
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J52 R-PDIP-T56
JESD-609 Code e3
Length 19.125 mm 52.07 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of I/O Lines 38 38
Number of Terminals 52 56
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SDIP
Package Equivalence Code LDCC52,.8SQ SDIP56,.6
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 512 512
ROM (words) 512 12000
ROM Programmability OTPROM MROM
Seated Height-Max 5.08 mm 5.08 mm
Speed 3 MHz 3 MHz
Supply Current-Max 35 mA 35 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology HCMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 1.778 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 19.125 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 5
Format FIXED POINT
Integrated Cache NO
Qualification Status Not Qualified

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