MC68HC11F1CFN4R2 vs MC68HC11F1MFN4 feature comparison

MC68HC11F1CFN4R2 Motorola Semiconductor Products

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MC68HC11F1MFN4 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description PLASTIC, LCC-68 QCCN, LCC68(UNSPEC)
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature 4 CHIP SELECT SIGNALS
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
CPU Family 6800 68HC11
Clock Frequency-Max 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQCC-J68 S-PQCC-N68
JESD-609 Code e0
Length 24.2062 mm
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 2
Number of I/O Lines 54 54
Number of Serial I/Os 2
Number of Terminals 68 68
Number of Timers 1
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCN
Package Equivalence Code LDCC68,1.0SQ LCC68(UNSPEC)
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified
RAM (bytes) 1024 1024
RAM (words) 512
ROM (words) 512
ROM Programmability EEPROM
Seated Height-Max 4.57 mm
Speed 4 MHz 4 MHz
Supply Current-Max 50 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form J BEND NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD QUAD
Width 24.2062 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 4
Date Of Intro 2016-07-20
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30