MC68HC11F1FN
vs
MC68HC11F1FN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA INC
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
PLASTIC, LCC-68
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| CPU Family |
6800
|
6800
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.2316 mm
|
24.2316 mm
|
| Number of I/O Lines |
54
|
54
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
LDCC68,1.0SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
1024
|
1024
|
| ROM (words) |
0
|
|
| ROM Programmability |
EEPROM
|
EEPROM
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Speed |
2 MHz
|
2 MHz
|
| Supply Voltage-Max |
5 V
|
5 V
|
| Supply Voltage-Min |
5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.2316 mm
|
24.2316 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
4
|
4
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare MC68HC11F1FN with alternatives
Compare MC68HC11F1FN with alternatives