MC68HC705B16MFU
vs
MC68HC705B16VFU
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP, QFP64,.66SQ,32
|
QFP, QFP64,.66SQ,32
|
Pin Count |
64
|
64
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
OPERATES AT 3.3V MINIMUM SUPPLY @ 1MHZ
|
OPERATES AT 3.3V MINIMUM SUPPLY @ 1MHZ
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
6805
|
6805
|
Clock Frequency-Max |
4.2 MHz
|
4.2 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
e0
|
Length |
14 mm
|
14 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP64,.66SQ,32
|
QFP64,.66SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
352
|
352
|
ROM (words) |
15168
|
15168
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
2.457 mm
|
2.457 mm
|
Speed |
2.1 MHz
|
2.1 MHz
|
Supply Current-Max |
6 mA
|
6 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MC68HC705B16MFU with alternatives
Compare MC68HC705B16VFU with alternatives