MC68HC705P6CDW
vs
MC68HC705P6VDW
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Package Description |
SOIC-28
|
SOP, SOP28,.4
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3V MIN SUPPLY @ 1MHZ
|
OPERATES AT 3V MIN SUPPLY @ 1MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
6805
|
6805
|
| Clock Frequency-Max |
4.2 MHz
|
4.2 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
17.925 mm
|
17.925 mm
|
| Number of I/O Lines |
21
|
21
|
| Number of Terminals |
28
|
28
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP28,.4
|
SOP28,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
176
|
176
|
| ROM (words) |
4672
|
4672
|
| ROM Programmability |
OTPROM
|
OTPROM
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Speed |
2.1 MHz
|
2.1 MHz
|
| Supply Current-Max |
7 mA
|
7 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
28
|
|
|
|