MC68HC705SP7S
vs
MC68HC705SP7S
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
WINDOWED, CERAMIC, DIP-28
|
WDIP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3V SUPPLY @ 1.05 MHZ
|
ALSO OPERATES AT 2.7 TO 3.3V SUPPLY @1.05MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| CPU Family |
6805
|
|
| Clock Frequency-Max |
4.2 MHz
|
4.2 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| Length |
37.145 mm
|
37.145 mm
|
| Number of I/O Lines |
22
|
22
|
| Number of Terminals |
28
|
28
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
WDIP
|
WDIP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE, WINDOW
|
IN-LINE, WINDOW
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
224
|
|
| ROM (words) |
6160
|
|
| ROM Programmability |
UVPROM
|
UVPROM
|
| Seated Height-Max |
6.09 mm
|
6.09 mm
|
| Speed |
2.1 MHz
|
2.1 MHz
|
| Supply Current-Max |
5.2 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|