MC68HLC98JK1EIDW
vs
MC68HLC98JK1EIDW
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
1.27 MM PITCH, MS-013AC, SOIC-20
|
SOP, SOP20,.4
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
CPU Family |
68HC08
|
68HC08
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
|
Length |
12.8 mm
|
12.8 mm
|
Moisture Sensitivity Level |
1
|
|
Number of I/O Lines |
14
|
15
|
Number of Terminals |
20
|
20
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP20,.4
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
128
|
128
|
ROM (words) |
1536
|
1536
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
2.65 mm
|
2.65 mm
|
Speed |
2 MHz
|
2 MHz
|
Supply Current-Max |
3.5 mA
|
3.5 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.4 V
|
2.2 V
|
Supply Voltage-Nom |
2.4 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5 mm
|
7.5 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|