MC7447AHX600NB vs PC7447MGU600LB feature comparison

MC7447AHX600NB NXP Semiconductors

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PC7447MGU600LB e2v technologies

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TELEDYNE E2V (UK) LTD
Package Description 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 BGA,
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36 36
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 167 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-B360
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 360 360
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.24 mm 3.2 mm
Speed 600 MHz 600 MHz
Supply Voltage-Max 1.35 V 1.35 V
Supply Voltage-Min 1.25 V 1.25 V
Supply Voltage-Nom 1.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

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