MC7447AHX600NB vs TSXPC750AMGSU/T10LH feature comparison

MC7447AHX600NB NXP Semiconductors

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TSXPC750AMGSU/T10LH Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ATMEL CORP
Package Description 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 CGA,
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.1 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
Address Bus Width 36 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 167 MHz 83.3 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B360 S-CBGA-X360
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 360 360
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA CGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.24 mm 4.2 mm
Speed 600 MHz 233 MHz
Supply Voltage-Max 1.35 V 2.7 V
Supply Voltage-Min 1.25 V 2.5 V
Supply Voltage-Nom 1.3 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL UNSPECIFIED
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code CGA
Pin Count 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Temperature Grade MILITARY

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