MC7448HX1250ND
vs
PPC7448VS1250ND
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
|
LGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.1
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
1250 MHz
|
1250 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-CBGA-B360
|
S-CBGA-N360
|
| JESD-609 Code |
e0
|
|
| Length |
25 mm
|
25 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
360
|
360
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
LGA
|
| Package Equivalence Code |
BGA360,19X19,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.8 mm
|
2.8 mm
|
| Speed |
1250 MHz
|
1250 MHz
|
| Supply Voltage-Max |
1.15 V
|
1.15 V
|
| Supply Voltage-Min |
1.05 V
|
1.05 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
25 mm
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC7448HX1250ND with alternatives
Compare PPC7448VS1250ND with alternatives