MC7448HX1250ND vs MC7448VU1250NC feature comparison

MC7448HX1250ND Freescale Semiconductor

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MC7448VU1250NC Freescale Semiconductor

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA LGA
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Pin Count 360 360
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.1 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 1250 MHz 1250 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
JESD-609 Code e0 e1
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA360,19X19,50 BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 1250 MHz 1250 MHz
Supply Voltage-Max 1.15 V 1.15 V
Supply Voltage-Min 1.05 V 1.05 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Additional Feature LOW POWER TAKEN FROM SLEEP MODE

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