MC7448VU1267ND vs MC7447AVU733NB feature comparison

MC7448VU1267ND NXP Semiconductors

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MC7447AVU733NB Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 BGA, BGA360,19X19,50
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.1 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 36
Bit Size 32 32
Boundary Scan NO YES
Clock Frequency-Max 1267 MHz 167 MHz
External Data Bus Width 64
Format FIXED POINT FLOATING POINT
Integrated Cache NO YES
JESD-30 Code S-CBGA-N360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code LGA BGA
Package Equivalence Code BGA360,19X19,50 BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 1267 MHz 733 MHz
Supply Voltage-Max 1.1 V 1.35 V
Supply Voltage-Min 1 V 1.25 V
Supply Voltage-Nom 1.05 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Form NO LEAD BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3
Pbfree Code No
Part Package Code BGA
Pin Count 360
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
JESD-609 Code e2

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