MC7457RX1267LC
vs
PPC7457RX1267LB
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
29 X 29 MM, 3.22 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-483
|
29 X 29 MM, 1.27 MM PITCH, CERAMIC, BGA-483
|
Pin Count |
483
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.A.1
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
36
|
36
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
167 MHz
|
167 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B483
|
S-CBGA-B483
|
JESD-609 Code |
e0
|
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
483
|
483
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA483,22X22,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.2 mm
|
3.2 mm
|
Speed |
1267 MHz
|
1267 MHz
|
Supply Voltage-Max |
1.35 V
|
1.35 V
|
Supply Voltage-Min |
1.25 V
|
1.25 V
|
Supply Voltage-Nom |
1.3 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
|
|
|
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