MC74F2968AJ vs N74F1763N feature comparison

MC74F2968AJ Motorola Mobility LLC

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N74F1763N YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, ,
Pin Count 48
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 18 20
Boundary Scan NO NO
External Data Bus Width
JESD-30 Code R-CDIP-T48 R-PDIP-T48
Length 60.96 mm
Low Power Mode NO NO
Memory Organization 256K X 1 1M X 1
Number of Banks 4 1
Number of Terminals 48 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.31 mm
Supply Current-Max 280 mA 220 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 1 1
Bus Compatibility 68030
Clock Frequency-Max 100 MHz

Compare MC74F2968AJ with alternatives

Compare N74F1763N with alternatives