MC74HC00ADR2G
vs
M54HC00F1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
SOIC-14 NB
|
DIP
|
| Package Description |
Sop, Sop14,.25
|
Dip, Dip14,.3
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
751A-03
|
|
| Reach Compliance Code |
Compliant
|
Not Compliant
|
| HTS Code |
8542.39.00.60
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Family |
Hc/Uh
|
Hc/Uh
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T14
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.65 Mm
|
20 Mm
|
| Load Capacitance (CL) |
50 Pf
|
50 Pf
|
| Logic IC Type |
Nand Gate
|
Nand Gate
|
| Max I(ol) |
0.0052 A
|
0.004 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
Plastic/Epoxy
|
Ceramic, Glass-Sealed
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP14,.3
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Small Outline
|
In-Line
|
| Packing Method |
Tr
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
55 Ns
|
27 Ns
|
| Propagation Delay (tpd) |
110 Ns
|
27 Ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
No
|
No
|
| Seated Height-Max |
1.75 Mm
|
5.08 Mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
Yes
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Military
|
Military
|
| Terminal Finish |
Matte Tin (Sn) - Annealed
|
Tin Lead
|
| Terminal Form |
Gull Wing
|
Through-Hole
|
| Terminal Pitch |
1.27 Mm
|
2.54 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 Mm
|
7.62 Mm
|
| Base Number Matches |
2
|
2
|
|
|
|