MC74HC132ADG vs TC74HC132AFN-ELP feature comparison

MC74HC132ADG onsemi

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Source Content uid MC74HC132ADG TC74HC132AFN-ELP
Pbfree Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 40 Weeks, 4 Days
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e0
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL TR
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V 2/6 V
Power Supply Current-Max (ICC) 75 mA
Propagation Delay (tpd) 190 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code No
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 28 ns

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