MC74HC153ADG vs TC74HC153AF-TP1 feature comparison

MC74HC153ADG onsemi

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TC74HC153AF-TP1 Toshiba America Electronic Components

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Pbfree Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code SOIC 16 LEAD SOIC
Package Description SOIC-16 SOP,
Pin Count 16 16
Manufacturer Package Code 751B-05
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3 e0
Length 9.9 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 5.3 mm
Base Number Matches 1 1
Rohs Code No
Propagation Delay (tpd) 38 ns

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Compare TC74HC153AF-TP1 with alternatives