MC74HC153ADR2G vs MC74HC257ND feature comparison

MC74HC153ADR2G onsemi

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MC74HC257ND Motorola Mobility LLC

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Pbfree Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI MOTOROLA INC
Part Package Code SOIC 16 LEAD DIP
Package Description SOIC-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code 751B-05
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e0
Length 9.9 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 3
Rohs Code No
Propagation Delay (tpd) 30 ns

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