MC74HC154DWR2
vs
MC74VHC259DTR2G
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
| Package Description |
0.300 INCH, PLASTIC, SOIC-24
|
TSSOP-16
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 ENABLE INPUTS
|
ADDRESS LATCHES
|
| Family |
HC/UH
|
AHC/VHC
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e4
|
| Length |
15.4 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
57 ns
|
14.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
4.4 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TSSOP-16
|
| Pin Count |
|
16
|
| Manufacturer Package Code |
|
948F-01
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Max I(ol) |
|
0.008 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
8
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
11.5 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC74HC154DWR2 with alternatives
Compare MC74VHC259DTR2G with alternatives