MC74HC165ADR2 vs HD74HC165RP feature comparison

MC74HC165ADR2 Freescale Semiconductor

Buy Now Datasheet

HD74HC165RP Hitachi Ltd

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS HITACHI LTD
Package Description SOP, SOP16,.25 SOP,
Reach Compliance Code unknown unknown
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Max Frequency@Nom-Sup 20000000 Hz
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supplies 2/6 V
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Part Package Code SOIC
Pin Count 16
HTS Code 8542.39.00.01
Count Direction RIGHT
Family HC/UH
Length 9.9 mm
Logic IC Type PARALLEL IN SERIAL OUT
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 190 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Trigger Type POSITIVE EDGE
Width 3.9 mm

Compare HD74HC165RP with alternatives