MC74HC273ADWG
vs
5962-01-369-4271
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC-20 WB
|
|
| Package Description |
SOIC-20
|
,
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
751D-05
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G20
|
|
| JESD-609 Code |
e3
|
|
| Length |
12.8 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
|
| Max Frequency@Nom-Sup |
20000000 Hz
|
|
| Max I(ol) |
0.006 A
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
220 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
7.5 mm
|
|
| fmax-Min |
24 MHz
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare MC74HC273ADWG with alternatives
Compare 5962-01-369-4271 with alternatives