MC74HC4053DW
vs
TC74HC4053AFN-TP2ELP
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.4
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Length |
10.3 mm
|
9.9 mm
|
| Neg Supply Voltage-Nom (Vsup) |
-6 V
|
-6 V
|
| Number of Channels |
1
|
2
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
40 dB
|
50 dB
|
| On-state Resistance Match-Nom |
10 Ω
|
5 Ω
|
| On-state Resistance-Max (Ron) |
140 Ω
|
100 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.75 mm
|
| Signal Current-Max |
0.025 A
|
|
| Supply Current-Max (Isup) |
0.16 mA
|
0.08 mA
|
| Supply Voltage-Nom (Vsup) |
6 V
|
6 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
15 ns
|
38 ns
|
| Switch-on Time-Max |
15 ns
|
38 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
3.9 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC74HC4053DW with alternatives
Compare TC74HC4053AFN-TP2ELP with alternatives