MC74HC4066AN vs HEF4051BT-T feature comparison

MC74HC4066AN Motorola Mobility LLC

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HEF4051BT-T NXP Semiconductors

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
Pin Count 14 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Analog IC - Other Type SPST SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDIP-T14 R-PDSO-G16
JESD-609 Code e0 e4
Length 18.86 mm 9.9 mm
Normal Position NO
Number of Channels 1 8
Number of Functions 4 1
Number of Terminals 14 16
Off-state Isolation-Nom 40 dB 50 dB
On-state Resistance Match-Nom 20 Ω 25 Ω
On-state Resistance-Max (Ron) 120 Ω 2500 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 1.75 mm
Supply Voltage-Max (Vsup) 12 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 2 V 5 V
Surface Mount NO YES
Switch-off Time-Max 80 ns 240 ns
Switch-on Time-Max 80 ns 280 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 5
Pbfree Code Yes
Rohs Code Yes
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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