MC74HC4066AN vs HEF4053BT,653 feature comparison

MC74HC4066AN Motorola Mobility LLC

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HEF4053BT,653 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOP
Package Description DIP, DIP14,.3 PLASTIC, SO-16
Pin Count 14 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDIP-T14 R-PDSO-G16
JESD-609 Code e0 e4
Length 18.86 mm 9.9 mm
Normal Position NO
Number of Channels 1 2
Number of Functions 4 3
Number of Terminals 14 16
Off-state Isolation-Nom 40 dB 50 dB
On-state Resistance Match-Nom 20 Ω 5 Ω
On-state Resistance-Max (Ron) 120 Ω 175 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 1.75 mm
Supply Voltage-Max (Vsup) 12 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 2 V 15 V
Surface Mount NO YES
Switch-off Time-Max 80 ns 220 ns
Switch-on Time-Max 80 ns 140 ns
Switching MAKE-BEFORE-BREAK BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT109-1
Moisture Sensitivity Level 1
Neg Supply Voltage-Nom (Vsup)
Peak Reflow Temperature (Cel) 260
Signal Current-Max 0.01 A
Supply Current-Max (Isup) 0.6 mA
Time@Peak Reflow Temperature-Max (s) 30

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